Berkeley Sensor and Actuator Center
Department of Mechanical Engineering
University of California
Berkeley, California 947201 USA
MEMS packaging has become a major manufacturing issue for commercialization. In the past twenty years, the application of microelectronic technology to the fabrication of mechanical devices stimulated emerging research in semi-conductor microsensors and microactuators. However, research on MEMS packaging issues have been generally neglected. This talk will introduce several thermal-bonding processes for MEMS packaging in an effort to address the MEMS packaging issues. These include an integrated LPCVD nitride bonding process; localized eutectic, fusion and solder bonding processes; RTP (rapid thermal processing) bonding processes; nano-second laser welding process; ultrasonic sealing process; localized CVD sealing process and low-temperature solder bonding processes. Specific issues in MEMS packaging applications will also be discussed, including vacuum encapsulation, accelerated testing and long-term reliability of the encapsulated MEMS devices.