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Chemical Engineering 234

Principles of Plasma Processing

No longer offered.  Last given in Spring, 2004


Course ID:  574165200

Instructors:   Professor Jane P. Chang            5532-D Boelter Hall     

                   Professor Francis F. Chen            56-147M Engr. IV

Office Hours:    ChE: 3-5 PM Wed., 5532D BH (Chang)
                       EE:   4-6 PM, 56-147M Engr. IV (Chen)



Plasma processing is widely used in the   microelectronics industry for deposition of thin film material (metal and dielectrics) and for etching of sub-100nm features.  The course  addresses the fundamental physical and chemical aspects of a plasma, its applications to semiconductor fabrication, and its measurement techniques.  The contents of this course have been written up in the following book.


Textbook:  F.F. Chen and J.P Chang, Lecture Notes on Principles of Plasma Processing (Kluwer/Plenum, 2003).  ISBN 0-306-47497-2.

Highly recommended reference books:

M. A. Lieberman and A. J. Lichtenberg, Principles of Plasma Discharges and Materials Processing (Wiley, 1994).

F. F. Chen,  Intro. to Plasma Physics and Controlled Fusion, Vol. 1, 2nd ed.  (Plenum, 1984).

B. Chapman  Glow Discharge Processes, (Wiley, 1986)


Homework:         Six homework sets.

Grading:              Homework 25%; 2 exams, 25% each; one final   

                             project, 25%.



Course Outline ] Syllabus ] Lecture notes ] Homework ]