| Dr. Bob Yu-Huan Xu Senior Research
Scientist Received Ph.D in Materials Science and Engineering, UCLA, L.A., CA Email:yuhuan@seas.ucla.edu ¡@ |
|
Dr. Luhua Xu Postdoc
Research Fellow Received PhD in Mechanical Engineering from Nanyang Technological University, Singapore,BS and MS in Materials Science and Engineering from TsingHua University, China. Research Interest: Electromigration in flip chip solder joint and through silicon vias(TSV), Electroplating of nano-twined Cu TSV Email:xuluhua@ucla.edu ¡@ |
| Di Xu Ph.D Student Received BS and MS in Materials Science and Engineering from Tsing Hua University, Beijing, China. Currently pursuing a PhD degree in Materials Science and Engineering at UCLA. Research Interest: Electroplating of nano-twined Cu films Email:dixu@ucla.edu ¡@ |
| Kai Chen Ph.D Student Received BS in Chemistry from Peking University, Beijing, China. Currently pursuing a PhD degree in Materials Science and Engineering at UCLA. He is taking an internship at Advance Light Source in Lawrence Berkeley National Laboratory from March 2007 to February 2008. Research Interest: Nano hollow spheres of SiO2 as ultra low k materials Email:kaichen124@ucla.edu ¡@ |
| Gordon Kuo-Chang Lu Ph.D Student Received BS in Materials Science and Engineering from National Chiao-Tung University, Hsinchu, Taiwan. Received MS in Materials Science & Engineering, UCLA. Currently pursuing a PhD degree in Materials Science and Engineering at UCLA. Research Interest: Point contact reactions in nanowires Email:gordonlu@ucla.edu ¡@ |
| Yi-Chia Chou Ph. D Student Received BS in Materials Science and Engineering from National Tsing Hua University, Hsinchu, Taiwan. Currently pursuing a PhD degree in Materials Science and Engineering at UCLA. Research Interest: Point contact reactions in nanowires Email:ycchou@ucla.edu ¡@ |
| Hsin-Ping Chen Ph.D Student Received BS and MS in Materials Science and Engineering from National Cheng Kung University, Tainan, Taiwan. Currently pursuing a PhD degree in Materials Science and Engineering at UCLA. Research Interest: Processing, microstructure, mechanical, thermal and electromigration of Cu interconnect and substrate solder materials. Email:hpchen@ucla.edu ¡@ |
| Jung Kyu Han Ph.D Student Received BS in Materials Science and Engineering from Yonsei University, Seoul, Korea Currently pursuing a Ph. D. degree in Materials Science and Engineering at UCLA. Research Interest: Flip-chip solder joints. Email:mablanche@ucla.edu ¡@ |
| Sutach Ratanaphan MS Student Received BS in Physics and Science from Mahidol University, Thailand . Currently pursuing a PhD degree in Materials Science and Engineering at UCLA. Research Interest: Thin films and grain growth Email:sutatch@ucla.edu ¡@ |
| Tian Tian Ph.D Student Received BS in Physics from Peking University, Beijing, China. Currently pursuing a PhD degree in Materials Science and Engineering at UCLA. Email:tian85@ucla.edu ¡@ |
| Wei Tang Ph.D Student Received BS in Physics from Peking University, China. Currently pursuing a PhD degree in Materials Science and Engineering at UCLA.. Email:weitang@ucla.edu ¡@ |
|
Shih-Wei Liang
Visiting Ph.D Student 3rd year Ph.D student in Materials Science and Engineering at National Chiao Tung University (NCTU), The advisor in NCTU is Prof. Chih Chen. Research Interest:Electromigration in flip chip solder joints and simulation on current density and temperature distribution in flip chip solder joints Email:shihwei.mse93g@nctu.edu.tw ¡@ |