UCLA-Materials Science Electronic Thin Film Lab at UCLA
 
 




























 
 

 
 
 
I. Simulation of Effects of Current Crowding and Contact Resistance on Electromigration in VLSI Interconnects

II. Morphology, Kinetics, and Thermodynamics of Wetting Reaction and Solid State Reaction between Sn-based Solders and Cu

III. Low Dielectric Constant Porous Thin Film

IV.  Synchrotron Radiation Study of Sn Whisker Growth on Pb-free Solder Finish

V.  Focused Ion Beam and Transmission Electron Microscope Study of Sn Whisker Growth on Pb-free Solder Finish

VI.  The Polarity Effect of Electromigration on Intermetallic Compound (IMC) Formation at Solder-Copper Interfaces

VII.  Precision Optical Packaging of V-grooved Fiber Array by Lead-free Solder

VIII.  Morphology Change of Intermetallic Compound formed by wetting reaction between SnPb alloys and Cu



current_crowding

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