Book Chapters and Review Articles (19)

1. D. Turnbull and K.N. Tu, "The Cellular and Pearlitic Reactions" in Phase Trans-formations, American Society for Metals, 1970, p. 487. (Based on an invited talk).
2. K.N. Tu and J.W. Mayer, "Silicide Formation," Chapter 10 in Thin Films - Inter-diffusion and Reactions, edited by J.M. Poate, K.N. Tu and J.W. Mayer, John Wiley (1978).
3. K.N. Tu and S.S. Lau, "Thin Film Deposition and Characterization," Chapter 5 in Thin Films - Interdiffusion and Reactions, edited by J.M. Poate, K.N. Tu and J.W. Mayer, John Wiley (1978).
4. J.M. Poate, K.N. Tu and J.W. Mayer, "An Overview," Chapter 1 in Thin Films - Interdiffusion and Reactions, edited by J.M. Poate, K.N. Tu and J.W. Mayer, John Wiley (1978).
5. K.N. Tu and R. Rosenberg, "Preparation and Property Correlation in Thin Films," Chapter 1 in Thin Films - Preparation and Properties, edited by K.N. Tu and R. Rosenberg, Academic Press (1982).
6. K.N. Tu, "Thin Alloy films for Metallization in Microelectronic Devices," Chapter 7 in Thin Films - Preparation and Properties, edited by K.N. Tu and R. Rosenberg, Academic Press (1982).
7. K.N. Tu, "Interdiffusion in Thin Films," Annual Review of Materials Science, ed. by R.A. Huggins, 15, 147-176 (1985).
8. K.N. Tu, "Metal-Silicon Reaction," Chapter 7 in Advances in Electronic Materials, ed. by B. Wessels and G.Y. Chin, American Society for Metals, Metals Park, Ohio (1986) p.147.
9. K.N. Tu and R. Rosenberg, "Submicron Structure and Microanalysis," Chapter 1 in Analytical Techniques for Thin Films, ed. by K.N. Tu and R. Rosenberg, Academic Press (1988) pp.3-11.
10. M. Murakami, A. Segmuller and K.N. Tu, "X-ray Diffraction Analysis of Diffusion in Thin Films" Chapter 6 in Analytical Techniques for Thin Films, ed. by K.N. Tu and R. Rosenberg, Academic Press (1988) pp.201-248.
11. L.J. Chen and K.N. Tu, "Epitaxial growth of transition-metal silicides on silicon," Materials Science Reports, 6, 53-140 (1991).
12. F. Nava, K.N. Tu, O. Thomas, J.P. Senateur, R. Madar, A. Borghesi, G. Guizzetti, O. Laborde and O. Bisi, "Electrical and Optical Properties of Single-Crystalline and Thin-Film Silicides," Materials Science Reports, 9, 141-200 (1993).
13. K.N. Tu and K. Zeng, "SnPb solder reaction in flip chip technology," Materials Science and Engineering Reports, R34, 1-58 (2001).
14. D. R. Frear and K. N. Tu, "Metallurgical factors," Chapter 28 in "Area Array Interconnection Handbook" edited by K. Puttlitz and P. A. Totta, Kluwer Academic Publishers, Boston (2001) pp. 1108-1144. (Book chapter)
15. K. Zeng and K. N. Tu, "Six cases of reliability study of Pb-free solder joints in electronic packaging technology," Materials Science and Engineering Reports, R38, 55-111 (2002)
16. K. N. Tu, A. M. Gusak, M. Li, "Physcis and materials challenges in Pb-free solders," J. Appl. Phys., 93, 1335-1553 (2003). (A Focused Review in Applied Physics Reviews.)
17. K. N. Tu, "Recent advances on electromigration in very-large-scale-integration of interconnects," J. Appl. Phys., (in press) (A Focused Review in Applied Physics Reviews).
18. J. R. Lloyd, K. N. Tu, and J. Jaspal, "The physics and materials science of electromigration and thermomigration in solders," Chapter 21 in "Pb-free Solders Handbook," edited by K. Puttlitz, Kluwer Academic Publishers, Boston (to be published in 2003). (Book chapter)
19. W. J. Choi, T. Y. Lee and K. N. Tu, "Structure and kinetics of Sn whisker growth on Pb-free solder finish," Chapter 21 in "Pb-free Solders Handbook," edited by K. Puttlitz, Kluwer Academic Publishers, Boston (to be published in 2003). (Book chapter)