UCLA-Materials Science Electronic Thin Film Lab at UCLA



Book and Proceedings Edited (14)

  1. A. Gangulee, P.S. Ho and K.N. Tu, "Low Temperature Diffusion and Applications to Thin Films," Elsevier Sequoia, 1975.
  2. J.M. Poate, K.N. Tu and J.W. Mayer, "Thin films - Interfdiffusion and Reactions," Wiley-Interscience, 1978.
  3. P.S. Ho and K.N. Tu, "Thin Films and Interfaces," MRS Proceedings, vol. 10, 1982
  4. E.A. Geiss, K.N. Tu and D.R. Uhlmann, "Electronic Packaging materials Science," MRS proceedings, Vol.40, 1985.
  5. G.S. Cargill, III, F. Spaepen and K.N. Tu, "Phase Transitions in Condensed Systems - Experiments and Theory," MRS Proceedings, Vol.57, 19876.
  6. C.Y. Wong, C.V. Thompson and K.N. Tu, "Polysilicon Films and Interfaces," MRS Proceedings, Vol.106, 1988.
  7. K.N. Tu and R. Rosenberg, "Preparation and Properties of Thin Films," Vo.4 in: Treatise on materials Science and Technologies, Academic Press, 1982.
  8. K.N. Tu and R. Rosenberg, "Analytical Technique for Thin Films," vol. 27 in: Treatise on Materials Science and Technology, Academic Press, 1988.
  9. R.W. Fathauer, S. Mantl, L.J. Schowalter and K.N. Tu, "Silicides, Germanides and Their Interfaces," MRS Proceedings, Vol 320, 1994.
  10. SP. Murarka, A. Katz, K.N. Tu and K. Maex, "Advanced Metallization for Devices and Circuits," MRS Proceedings, Vol. 337, 1995.
  11. R.C. Sundahl, K.N. Tu, K.A. Jackson and P. Borgesen, "Electronic Packaging Materials," VIII, MRS Proceedings, Vol. 390, 1995.
  12. K.N. Tu, J.W. Mayer, J.M Poate and L.J. Chen, "Advanced Metallization for Future ULSI," MRS Proceedings, Vol. 427, 1996.
  13. M. Zhang and K. N. Tu, Proceedings of 5th International Conference on Solid State and Integrated Circuit technology," CIE, Beijing, pp.1-920, 1998.
  14. D.C. Edelstein, T. Kikkawa, M.C. Ozturk, K.N. Tu, and E.J. Weitzaman, "Advanced Interconnects and Contacts," MRS Proceedings, Vol. 564, 1999.

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