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Talk Abstracts
(Listed in alphabetic sequence by last names of first authors)
Donald C. Abbott, Texas Instruments, Attleboro, MA
NiPd Finishes for Pb-Free Leaded Components
J.K. "Kirk" Bonner, L. del Castillo, and A. Mehta, JPL, Pasadena, CA
Choosing the Right Lead-free Solder for Hi-Rel Printed Wiring Assemblies
Chi Shih Chang, Kulicke & Soffa
Review of Electronics Packaging Issues in ITRS 2001
D. R. Frear and J.-K. Lin, Motorola, Tempe, AZ
Pb-free Solder Interconnects for Flip Chip and Area Array Interconnects
Yifan Guo, Skyworks Solutions, Newport Beach, CA
Mechanical Reliability of Flip Chip Interconnection in Pb-free Systems
Carol Handwerker, NIST, Gaithersburg, MD
NIST program on Pb-free solder
Fay Hua, Intel Corporation, Santa Clara, CA
Pb-free Solder Challenges in Electronic Packaging and Assemblies
Sungho Jin, UC San Diego, CA
Universal solder for optical and MEMS packaging
Sung K. Kang, IBM T. J. Watson Research Center, Yorktown Heights, NY
Recent Progress in Pb-Free Solders and Soldering Technologies
John H. Lau, Agilent Technologies, Santa Clara, CA
Nonlinear Analysis of the Lead-Free Solder Sealing Ring of a Photonic Switch
Chin C. Lee, UC Irvine, CA
Fluxless Soldering Technology for MEMS and Photonics
Liwei Lin, UC Berkeley, Berkeley, CA
Packaging issues of MEMS devices
J.R. Lloyd, IBM T.J. Watson Research Center, Yorktown Heights, NY
Interesting Behavior in Sn During Electromigration Testing
J.W. Morris1, Jr., H.G Song1 and F. Hua2, 1UC Berkeley and 2Intel, CA
The microstructure and creep properties of Pb-free solder joints
Tsung-Yu Pan, Ford Motor Company, Dearborn, MI
Pb-free solder applications and requirements in automotive industry
Weiqun Peng, Steve Dunford, Viswanadham Puligandla, and Stephen Quander,
Nokia, Dallas, TX
Microstructure Aspects and Performance Implications of Sn/Ag/Cu/Sb Solder Joints in the Presence of Gold
Srinivas T. Rao, NEMI, Milpitas, CA
The No-Lead Manufacturing Initiative at NEMI
Julie Schoenung, UC Davis, CA
Toxicity, availability and extraction of the metals used in Pb-free solder
M.C. Shaw and J. He*, California Lutheran University and *Intel
Effects of Viscoplasticity on Perimeter Stress Distributions and Reliability in Multilayered, Ductile/Brittle Electronic Packages
N. Tamura, Lawrence Berkeley National Laboratory, Berkeley, CA
Synchrotron radiation X-ray microdiffraction study of Pb-free solders
K. N. Tu, Gu Xu, Hua Gan, and W. J. Choi, UCLA, CA
Electromigration in Pb-free solder joints and lines
Paul Totta, IBM East Fishkill, NY
Forty Years of Flip Chip with Solder Bumps
P. Vianco and and J. Rejent, Sandia, Albuquerque, NM.
Sandia program on Pb-free solder
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