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Poster Abstracts
(Listed in alphabetic sequence by last names of first authors)
Synchrotron radiation Scanning X-ray micro-diffraction study of Sn whiskers on Pb-free surface finish
W. J. Choi, T. Y. Lee, and K. N. Tu, UCLA;
N. Tamura, R. S. Celestre, and A. A. MacDowell,
Advanced Light Source, LBNL, Berkeley;
Y. Y. Bong, and Luu Nguyen,
National Semiconductor Corporation.
The polarity effect of electromigration on intermetallic compound (IMC) formation in solder V-groove samples
H. Gan and K. N. Tu, UCLA;
A fluxless Au-Sn process achieved in air ambient
Dongwook Kim, Ricky Chuang and C.C. Lee UC Irvine;
Morphology, kinetics, and thermodynamics of solid state aging of eutectic SnPb and Pb-free solders (SnAg3.5, SnAg3.8Cu0.7 and SnCu0.7) on Cu
T. Y. Lee, W. J. Choi, and K. N. Tu, UCLA;
J. W. Jang, S. M. Kuo, J. K. Lin and D. R. Frear, Motorola;
K. Zeng, and J. K. Kivilahti, Helsinki University of Technology,
Finland.
New Failure Mode Induced by Electric Current in Flip Chip Solder Joints
Y. H. Lin, E. C. Hu, and C. Robert Kao, National Central University, Taiwan.
Precision Optical Packaging of V-grooved Fiber Array by Lead-free Solder
Sheng-Quan Ou, Gu Xu, Yuhuan Xu, and K. N. Tu, UCLA
Tin Whiskers Studied by Focused Ion Beam Imaging
and Transmission Electron Microscopy
George T. T. Sheng and C. F. Hu
Macronix International Co., Taiwan;
W. J. Choi and K. N. Tu, UCLA;
Y. Y. Bong and Luu Nguyen,
National Semiconductor Corporation.
Effect of Cu Concentration on the Solid-State Aging Reactions between SnAgCu Lead-Free Solders and Ni
L. G. Shiau, C. E. Ho, W. C. Luo, and C. Robert Kao,
National Central University, Taiwan
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