Time: September 5~6, 2002

Location: UCLA Faculty Center, 480 Charles E. Young Drive East,Los Angeles, CA, 90095-1617
                 (Corner of Hilgard Ave. and Westholme Ave.)

Solder is widely used in electronic manufacturing. In electronic consumer products, chips are connected to boards or cards by solder surface mount technology. In mainframe computers, area arrays of tiny solder bumps are used to bond chips to multi-leveled ceramic modules or polymer boards by flip chip technology. In optical packaging, the use of solder to join optical fibers to V-grooves can achieve both high precision alignment and signal isolation. In MEMS devices, solder can provide hermetic seal. Due to environmental concern, Pb-free solder is urgently needed in applications to these technologies. This workshop is aimed to provide a critical review of the challenges in Pb-free solder for these applications. Also it is a forum to enhance the exchange of ideas and knowledge of Pb-free solder among workers in industry, academics, and national laboratories. The industry may be reluctant to give up Pb-based solder, especially the high-Pb solder, until the performance, yield, and reliability of Pb-free solder have been proven acceptable.

The Workshop will consist of three half-day sessions of oral presentation and a two-hour round table discussion at the end. Also a poster session will be organized. Submission of poster papers to this Workshop is welcome and deadline of the abstract (half page) for poster papers is July 31, 2002. Please send the abstracts to kntu@ucla.edu. Posters from UC students will be especially welcome.